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"Advanced thermal management and embedded coin technologyHigh Performance and Emerging Materials; Halogen free,low loss,ultra-thin,mixed packages, inlay
Sequential Lamination
High Tech Drilling Capability – Small hole drilling, Backdrilling
Mechanical depth control drilling with +/-10um tolerance,min drill
size 0.15mm
Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)
http://www.hemeixinpcb.com"
