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SpecificationsPolyamide resin good solvent release quick speed of drying. excellent stability and adhesion applied in printing Polyamide Hot melt Adhesive formed by the high-temperature condensation reaction of dimer acid and the multi-dimensional amine. It is able to dissolve in general organic solvent. Its melt viscosity has great relationship with the temperature. low viscosity,Website:http://www.skivingmachine.com, good flow performance, excellent flexility, and strong cohesive force. Properties:Good flow performance.Excellent flexility and low viscosity.Strong cohesive force. Application: