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Application: Amplifier/Heavy current supply module/LedLayer: 4 layers
Board thickness: 3.0mm
Finish: ENIG
Min line width/gap: 9.8/7.7mil
Min Hole: 0.25mm
Technical feature: High heat Dissipation, Embedded metal core pcb
metal core pcb
2017-01-11 13:37 Views:126
Price:Negotiable
Layer: 4 layers
Board thickness: 3.0mm
Finish: ENIG
Min line width/gap: 9.8/7.7mil
Min Hole: 0.25mm
Technical feature: High heat Dissipation, Embedded metal core pcb
Layer: 4 layers
Board thickness: 3.0mm
Finish: ENIG
Min line width/gap: 9.8/7.7mil
Min Hole: 0.25mm
Technical feature: High heat Dissipation, Embedded metal core pcb
Contact Infomation
Send Inquiry
Company name:Hong Kong Kart Electronics Limited
Status:[Offline] [Send message] [Chat]
Business contact:Selina (Ms.)
Telphone:
Area: Caribbean Region-Bermuda
Address:No.588 Bulong Road, Longgang District, Shenzhen
Zip:518129
Status:[Offline] [Send message] [Chat]
Business contact:Selina (Ms.)
Telphone:
Area: Caribbean Region-Bermuda
Address:No.588 Bulong Road, Longgang District, Shenzhen
Zip:518129