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Layers(2-38)Lines and Spaces(Volume 3/3 Prototype 2.5/2.5)
Controlled Impedance(+/- 10% Standard)
Blind and Buried Vias
Microvias,Laser Drill
Backpanels (up to 1 inch thick)
MCM/Substrates
High Performance and Emerging Materials
Sequential Lamination
Micro BGA,BGA Plug
Finishing: Entek(OSP),HAL,HAL Lead Free, Immersion Glod, Flash Gold, Immersion Sliver, Immersion Tin
Special PCBs
Heavy Copper PCBs
For more detailed information, welcome to visit our website at http://www.wwteq.com/wwteq_Category_423735_1.html
