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This machine with heads formechanized tweezers pick up and placement of die, and for vacuum pickup and placement of preforms. Tweezers clamping force is set anddisplayed by an included load cell calibration fixture, to hold thevery low values necessary to place fragile die which would be damagedby other handling means. The preform head includes the standard meansto rotate preforms at placement. Mechanical scrub motion for the bondhead, driven by the transfer motor, is programmable in both amplitudeand number of repetitions. Head lift motion is locked out pneumaticallyduring scrub. Bond force is adjusted by a low rate coil spring. Thismachine is very easy to use.SPECIFICATIONS:ConTROL LOGIC: Motorola 68000 MicroprocessorMEMORY: Battery back-up RAM DATA ENTRY: Selector switch Z TOOL RANGE: 0.5625 inch Z ENCODER RESOLUTION: 0.001 inchWORK PLATFORM: Elevation adjustable through 0.625 inchBOND FORCE RANGE: Adjustable, 10 to 175 grams TRANSDUCER: ½ wave, 63 KHz (nominal) ULTR