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ProductUnitsKD801KD802Test methodBacking Thickness:mm0.025 0.025 Total Tape Thickness:mm0.040 0.066 Adhesion to Steel:N/cm1.42.5GB-T2972Tensile Strength at Break:N/cm5858GB-T7753Elongation at Break:%6060GB-T7753Upmost use Temperature :° C260260Surface resistance:ohms>106>106Static Charge:Removal from roll:V<150<150Removal from SUS:V<50<50ApplicationMask for printed circuit boards during wave solder or solder dip process.FeaturesEmploys a proprietary technology that results in extremely low electrostatic discharge at unwind and removal form SUS. Conventional polyimide tape typically generate over 10,000volts during use which can damage around electronic components . The low static properties of KD801/802 can eliminate circuit board degradation.Storage DetailsStore under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging.shelf life is 6 months from the date of manufacture.