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0201 technology is the frontier of passive component miniaturization. 0201 components increase board density and enhance electrical performance.Topscom has done extensive studies on 0201 technologies and has published a number of papers on pad design, stencil design, solder paste evaluation, component specification and vendor evaluation, equipment qualification, assembly process optimization, rework, AOI, and reliability. Various designs have been developed for large- and small-form factor applications.At Topscom, we have also made advances in lead-free solder, 0201 under BGA, and other specia