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Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, including:Solder Bumped Flip Chip TechnologyAnisotropic Conductive Adhesive Flip Chip TechnologyUltrasonic Bonding Flip Chip TechnologyIn addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.Flip Chip Technologies
2017-02-13 01:35 Views:143
Price:Negotiable
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Company name:Topscom technology.Co.,LtD
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Business contact:Dr.FrankWu(Mr.)
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Area: Caribbean Region-Bermuda
Address:No 18, Tannan Road,Tanjia Industrial Village,Gongming Street,Guangming New District,Shenzhen City,China., shenzhen
Zip:518000
Status:[Offline] [Send message] [Chat]
Business contact:Dr.FrankWu(Mr.)
Telphone:
Mobile:
Area: Caribbean Region-Bermuda
Address:No 18, Tannan Road,Tanjia Industrial Village,Gongming Street,Guangming New District,Shenzhen City,China., shenzhen
Zip:518000