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Software for 3D Modeling of Current Spreading and Temperature Distribution in LED chip. The device-engineer oriented software package SpeCLEDUs / products / SpeCLED / is intended for simulation of current spreading and heat transfer in planar and vertical light-emitting diode chips with complex contact electrode configuration. The package enables simulations of the integral parameters of the device, forward current, output emission power, wall-plug efficiency, integral emission spectrum, etc. As a function of the forward voltage applied. In addition, the distributions of the current density and temperature over the chip are computed and their effects on the integral device parameters are predicted by the code. Every LED chip is considered in the SpeCLED package as that fabricated by planar technology operations. This allows the layer-by-layer input of the actual 3D chip geometry, which is operative, pictorial, and easy-to-learn. Functionality of the layers specified by user serves as t