Brand: ENSAP                             CODE: MS2000

Grade: 25LM                                  Modulus: 0.2

Elastic recovery rate:88%            Loss of Volume: <2%

Hardness:25                                   Density:1.1

PRODUCT DEscriptION:

1. Fast cure independently

2. High joint movement, ±25%HM

3. Extreme long Service life

4. Variety substrates