1. Features

•   Low viscosity,good work-ability
•   Good thermal conduction,insulation and dielectric
•   No-corrosive to materials
•   Mixed at a ratio of 1:1 and thoroughly cured

2. Description

ZS-GF- 5299D is two components thermal conduction addition silicone potting sealant with low viscosity,  which  at  room temperature  curing or heat curing. The higher temperature,  the quicker cured.  This product will not  produce any byproduct, and It is adapted to metal surface or all kinds of material like PC,PP,ABS,PVC. which also is widely used in  LED power  modules,adapters,inverters,transfomers,ballasts,sensors,electronic accessories for water proof ,insulation  and  thermal  conduction, Completely complied with RoHS of EU directive.

3.TECH.DATA

Performance Indicators	A	B
Appearance	Black	White
Viscosity(cps)	1500～2500	1500～2500
A:B(Mixing ratio by weight)	1:1
Mixed viscosity(cps)	2000～3000
Operable time(min)	40-80(Adjustable)
Curing time(min)	60
Hardness(Shore A)	45~55
Dielectric strength(kV/mm)	22
Dielectric constant(1.2MHz)	3.12
Thermal conductivity[W/m.k]	≥0.6
Volume Resistivity(Ω·cm)	1.8×1014
Specific gravity(g/cm3)	1.56±0.02   Contact Infomation Send Inquiry Company name:Guangzhou Usilicone Chemical Co., Ltd Status:[Offline] [Send message] [Chat] Business contact:selinajiang (Mr.) Telphone: Area: Caribbean Region-Bermuda Address:97 Science Road, Luogang district, Guangzhou, Guangdong,Chin Zip:523233