Main features                                                  

l  Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.

l  Temperature parameters protected by limits of authority, for avoiding error settings.

l  Ten segments of temperature control process, suitable for all kinds of BGA Rework.

l  Unlimited storage of the temperature profile, just need press one key to use the profile.

l  Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.

l  Desoldering and soldering automatically, No need the manual adjustment

l  Hot air flow can be adjustable to meet the demand of any chips

l  USB Connection driver-free, PC control

l  The bottom hot air lifting control available in the front panel, it is convenient to adjust at any time.

l  Laser positioning available, to make the positioning faster.

Main technical parameter