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PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger Hole Size 0.2mm
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| Product Description |
| Model Number: | CTEL1010200 |
| Number of Layer: | 10Layer |
| Material: | FR4 tg170 |
| Finish Thickness: | 2.4mm |
| copper: | 1oz |
| PCB Size : | 55*109mm |
| Line Width/line space | 10/8mil |
| Min.Hole size : | 0.2mm |
| Surface finish : | Gold finger |
| Green solder mask | |
|
| White sillkscreen |
| Place of Origin: | China |
| Brand Name: | ChiTun |
| Certification: | UL,ROHS,ISO |
| Standard: | IPC standard |
TECHNOLOGY:
. RoHS/ Lead Free
. HDI Microvias
. Blind Vias
. Buried Vias
. Selective Plating
. Impedance Control
Manufacturing Standard:
. IPC-A-600G Class II
. IPC-A-600G Class III
. PERFAG 2E for Double-Sided Board
. PERFAG 3C for Multilayer Board
Capability
Min. Finished Holes Size: 0.008" (0.20mm)
Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)
Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)
Maximum copper thickness: 5oz (140um)
Thin board thickness:
. DS - 0.008 inches (0.20mm)
. 4/L - 0.016 (0.40mm)
. 6/L - 0.020 inches (0.60mm)
Maximum board thickness:
. 275.8mil (7.0mm)
Surface treatment:
. HASL/lead free HAL/gold plating
. Immersion gold
. Immersion tin
. Immersion silver
. Gold fingers (hard gold)
. OSP
