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ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer
2016-09-24 00:21  Views:214
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ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer

 

 

Quick Detail:

 

  1. OEM/ODM/EMS services for PCBA 
  2. PCBA, PCB assembly: SMT, PTH and BGA
  3. PCBA and enclosure design
  4. Quick prototyping
  5. Plastic injection molding
  6. metal sheet stamping
  7. Final assembly
  8. Test: AOI, in-circuit test (ICT), functional test (FCT)

 

Detailed Specification of PCB Manufacturing

 

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, 

Polyimide, 

Aluminum-based

 material. 

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ 

Silver/Tin,

 Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

 

 

 

Detailed Specification of Pcb Assembly

 

 

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Contact Infomation
Send Inquiry
Company name:Huaswin Electronics Company Group
Status:[Offline] [Send message] [Chat]
Business contact:Vicky Lee (Ms.)
Telphone:
Mobile:
Fax:
Area: Caribbean Region-Bermuda
Address:28D, Block D, Jin Gang Hua Ting
Zip:518000

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA