Chip-On-Glass (COG) is a flip chip bonding method which 

is used for connect assembly of bare integrated circuits 

on glass substrate directly by using Anisotropic Conductive Film . 

The pitch of the IC bumps can be scaled down according to customers'

requirements . This method reduces the assembly area to the highest 

possible packing density, which especially important to those

applications that space saving is crucial. It allows a 

cost-effective mounting of driver chips because integrating 

flex PCB is no longer required. The IC is bonded directly onto

the glass substrate and is suitable for handling high-speed or high-frequency signals.

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