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Power Converter PCB Thermal Conductive Adhesive , Glass Fiber Backing Pressure Sensitive Acrylic Adhesive
The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
> Thermal Conductivity: 1.0 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
| Typical Properties of TIA™800FG Series | |||||||
| Product Name | TIATM805FG | TIATM806FG | TIATM808FG | TIATM810FG | TIATM815FG | TIATM820FG | Test Method |
| Color | White | Visual | |||||
| Adhesive Type | Acrylic Adhesive | ******** | |||||
| Backing Type | Glass fiber | ******** | |||||
| Composite Thickness | 0.005" 0.127mm | 0.006" 0.152mm | 0.020" 0.203mm | 0.010" 0.254mm | 0.015" 0.381mm | 0.020" 0.508mm | ASTM D374 |
| Aluminum Foil Thickness | ±0.001" ±0.025mm | ±0.001" ±0.025mm | ±0.0012" ±0.03mm | ±0.0012" ±0.03mm | ±0.0015" ±0.038mm | ±0.002" ±0.05mm | ASTM D374 |
| Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
| Peel Adhesion | 1200 g/inch2 | JIS K02378 | |||||
| Holding Power 25/Days | > 120 kg/inch2 | JIS K023711 | |||||
| Holding Power 120/Hours | > 10 kg/inch2 | JIS K023711 | |||||
| Recommend Using Pressure | 10 psi | ******** | |||||
| Thermal Conductivity | 1.0 W/mK | ******** | |||||
| Thermal Impedance@50psi | 0.52-in²/W | 0.59-in²/W | 0.83-in²/W | 0.91-in²/W | 1.15-in²/W | 1.43-in²/W | ASTM D5470 |
