High Frequency Microprocessors Thermal Interface Pad Low Resistance -25 - 125

  The TIC™800P Series is low melting point thermal interface material. At 50, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

     The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130,or after 500 cycles, from -25 to 125.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

Features:

>  0.024-in² /W thermal resistance
>  Naturally tacky at room temperature, no adhesive required             
>  No heat sink preheating required 

Applications:
>  High Frequency Microprocessors
>  Notebook and Desktop PCs
>  Computer Serves
>  Memory Modules
>  Cache Chips
>  IGBTs

Typical Properties of TIC™800P Series

Product Name Contact Infomation Send Inquiry Company name:Dongguan Ziitek Electronic Materials & Technology Ltd. Status:[Offline] [Send message] [Chat] Business contact:Miss. Jor (Ms.) Telphone: Mobile: Fax: Area: Caribbean Region-Bermuda Address:Building B8, Industry District Zip:511700