MLCC MLCL MLV Silver Carrier Plate / Array Thin Carrier Plate ATCP 1.3mm Chip Parts Precision Components 

Thin Carrier Plate is Dipping Tool which can be used successfully to handle a veriety of Chip            
componets such as MLCC ,MLCI,MLV Etc. they mainly used in the Dipping Machine and Yohotek Dipping Machine  

         
Feature 

           
1: Work temperature:130 or 160            
2: Thickness:1.30mm(±0.02)            
                   
            
Advantages

       
Holding chip(Dipping chip)            
High Load efficiency            
Low distortion            
Save time,Reduce labor and Tooling cost of Dipping            
0603(0201) chip can be dipped Two side Easily            
Defect-Free Dipping surface            
Easy to Operate Automatically            
Termination Bandwidth is easily controlled            
MOQ:1000pcs
Customized design is available. OEM&ODM are welcome.

                
Specification
                
Item No : YTCP0402-020-13776-130                
Hole Diameter(mil):   20.00

Hole Qty(mm) : 3776

Thickness(mm) : 130.00 

           
Remark:

Customized design is available. OEM&ODM are welcome.                
    

            
Applications:

1: For Holding chip(Dipping chip)             
2: Auto-loading machine/Vibration machine, Air press,Dipping machine,oven,    

                
Trade terms & conditions:                  
                
1. Payment term: 100% for sample; For bulk order: 30% deposit and 70% balance before shipment.          2. Payment way available: T/T, Paypal, Western Union. L/C                
3. Lead time: 3-5 working days for samples, 10-15 working days for quantity order.                
4. Shipping port: Shenzhen.                 
5. Delivery way: Via Sea, Air and Air express (DHL, FEDEX, EMS, UPS, TNT) or other ways.                 
6. MOQ: 5 piece.                
7. Discounts: