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Solderability Testing Device KH23
Product Attributes:
| Product name | Solderability Testing Device |
| Brand Name | ASIDA |
| Model Number | KH23 |
| Place of Origin | China |
| Packaging Details | Wooden Carton |
Solderability Testing Device KH23 JX22/JX23 Use:
This machine is used to test solderability and heat stress for PCB.
Solderability Testing Device KH23 Features:
1. Internal container is made by special material that conforms to the lead-free standards.
2. Patented design that adopts PID temperature adjustment unit to create stable,uniform and precise
temperatures.
3. Time adjustment and alarm functions
4. Conform to flexible PCB technical manual: GB/T 4677-2002;IPC-TM-650 2.4.12-1996IPC-TM-650 2.4.13-1998.
Solderability Testing Device KH23Parameters:
| Item | SPECIFICATION |
| Model | KH23 |
| Internal dimension | 190×250×80(L×W×H) |
| Shape diameter | 450×380×320(L×W×H) |
| Control box dimension | 300×170×150(L×W×H) |
| Volume of soldering tin | 1.902.53L ( Weight: 13.418.0kg) |
| Temperature adjustment range | ~300 |
