marina@etlimited.cn
base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1, FR2, CEM-1, CEM-3, etc.
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
PTH hole diameter tolerance: 0.076mm (3mil)
NPTH hole diameter tolerance: 0.03mm (1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers