LED electronic embedment refers to the process that fixes or seals up a number of luminous diodes in a certain chamber by using pouring sealant as needed. It is necessary to select different potting compound for different situation and pot in a different way. Common potting compound includes solid and rigid epoxy potting compound, soft and elastic silicon rubber potting compound and PU potting compound etc. The micro-embedment dispersion glue moulding machine of  ”Huagong“brand of Dalian Huagong Innovation Technology has ten-year quality assurance and is trustworthy!