Dimension: 156mm× 156mm± 0.5mm
Wafer thickness: 220μm± 30μm
Grade: A

Front(-): Two 2.0mm wide bus bars (silver), PECVD SiN
Back(+): 4.0mm wide silver soldering pads, aluminum back surface field
POCC156  Efficiency  PMP  Ump  Imp  Uoc  Isc
UBPO1356  13.56%  3.300521  0.500184  6.598615  0.599531  7.072881
UBPO1372  13.72%  3.339574  0.503973  6.626497  0.599338  7.18278
UBPO1401  14.01%  3.408061  0.505779  6.739312  0.601782  7.280262
UBPO1430  14.30%  3.480496  0.502321  6.928832  0.604334  7.332991
UBPO1470  14.70%  3.577401  0.522337  6.848833  0.613241  7.454015
UBPO1501  15.01%  3.651782  0.523148  6.980398  0.617886  7.541259
UBPO1510  15.10%  3.675536  0.515493  7.130131  0.618791  7.555912
UBPO1521  15.21%  3.700882  0.520025  7.116734  0.619601  7.588226
UBPO1530  15.30%  3.723547  0.514422  7.238315  0.621437  7.617948
UBPO1540  15.40%  3.748381  0.514587  7.284249  0.620567  7.663831
UBPO1550  15.50%  3.772385  0.522496  7.21993  0.623142  7.669637
UBPO1560  15.60%  3.796747  0.524786  7.234849  0.62374  7.718042
UBPO1571  15.71%  3.821683  0.52217  7.318854  0.622436  7.774541
UBPO1581  15.81%  3.846443  0.529491  7.264409  0.626153  7.764514.