Applications

For cutting and grinding monocrystallinesilicon,polysilicon,gallium arsenide and quartz crystal in thesolar cells,semiconductors and piezo quartz industry.

 Quality Standard

Particle Size:JIS R6001-1998(by Beckman CoulterMultisizerTm3)
Composition:GB/T3045-2003(by chemical analysis method).
Special inspection based on customers' need.

Features

1.High purity and large crystal silicon carbide ingots ensurethe excellent cutting capability and stable physical condition.
2.Grains are isometric with sharp edge, which ensure the evenself-sharpening capability as cutting material and minimum TTV ofthe products been cut.
3.Particle size distribution is narrow and even under loadguarantee the small wire expansion in processing, suitable to allkinds of wire saw machine.
4.Micropowder has large specific and cleanness surface afterspecially treated, and easily fit cutting fluid, such aspolyethyleneglycol.

Parameter

Silicon Carbide Micropowder for Multi-wire Cutting &Grinding