Used Packaging: SOT, TSOP, PLCC, QFP, QFN/MLF, BGA

UPH: 18000
Wafer: Max 8 inches(200mm)
Chip Size: 0.2mm*0.2mm-2mm*2mm
Application: Leadframes, PCB

Dimension of Leadframe:
L: 6.0-11.4 inch (150-290mm)
W: 0.6-3.15 inch (15-80mm)
H: 4-30mil (0.1-0.75mm)
Wafer Table: 237.5*237.5mm

Dimension:
Unpack: 1810*1035*1446mm
Packed: 1910*1280*1710mm
Bonding Power: 30-2000g
Bonding Accuracy: ± 50??m, ± 3°
Compressed Air: 0.5MPa
Voltage: 220VAC
Power: 1800 W