Lead-free solder paste Sn64/Bi35/AG1.0 NC998 series cleaning-free solder paste is designed for SMT produce technical, be fine of special aid-soldering paste and less oxide ball-shade tin power. The aid-soldering paste contain is use from low-ionic activate-dose system, make few leftover and quite high insulating impedance after re-soldering, high security even cleaning-free. On the other hand, NC998 series cleaning-free solder paste provides different alloy component, different diamond of tin power and different medal component; Satisfy with different produce and demand of technical of clients.

Melting point: 138-187 centigrade

Alloy density: 7.8g/cm³ .