Features
This machine can adjust the focus by itself and append the material automatically with PLC controlment. It has a high-precision and automatically rolling worktable so the precision that Orientate the material repeatly is less than 10. Equipped with imported semiconductor pumped laser, high-level laser quality, tiny focus spots then with excellent beam quality, high run precision, high cutting speed, good cutting quality, and high stability and so on.

Application:
Used in cutting the delicate stainless steel, Si, Ge, gallium arsenide, and other semi-conductor material and pottery.