Model:
1) Lead-free solder wire and bar
2) Ordinary solder wire
3) Solder paste

Specifications:
1) We produces Lead-free solder wire and bar including Sn/Cu, Sn/AG, Sn/Sb, Sn/AG/Cu, Sn/AG/Bi alloys.
2) We supplied various specifications of solder tin wire, different tin content and wire diameter from 0.3mm to 9.0mm.
3) Solder tin paste is the most important joint material for modern printing wring board and surface makeup technique(SMT). It is determinative factor for ideal and steady soldering effect that chooses appropriate tin paste. Its alloy composition and content and flux type should be concerned.