Product Description
The top cover uses rotated press-down structure to assure the pressurerof the BGA is stable and average.
1. Special probe tips can pierce the oxide coating of the solder ball but not damage it.,
2. High-precision guilding pin and hole are used to guarantee the BGA location.
3. Use floating plate structure.
4. Test probes SPEC: Double-ended probe 11mil~39mil(0.28mm~0.99mm).
5. Probes can be replaced therefore easy maintenance and low cost.
6. Smallest drilling pitch =11mil( 0.28mm )(distance of pin center )