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Description:
PCB specifications:1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML
2) Max. spelling board
PCB specifications:1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML2) Max. spelling board size: 457 x 762mm, large board size possible upon requests3) Layers single double 4-16 layers4) Board thickness: 0.2-2.5mm5) The smallest aperture: 0.2mm6) The smallest width of line: 0.10mm7) The smallest distance of line: 0.10mm8) The smallest SMT jointing plate: 0.3mm9) Warp permitting value of board surface: -0.7%10) The smallest bridge of hinder jointing: 0.10mm11) Surface craft: HAL flash gold OSP cold contacts immersion gold12) Special craft: blue or yellow character open hole or taphole13) Hinder jointing: liquid sensitization glue14) Skewer head gilt: nickel 5um; gold 0.75um15) Figuration making: Numerical control mill/opened V trough/rush and cut16) Solder mask: PSR4000, PSR220017) Profile: routing, punching, scoring18) Inspection: 100% E-test 100% visual inspection, AOI for inner-traceFPC specifications:1) Film thickness: PI 25 35 50 75 100um2) PET: 12.5 25 35 50 75um3) The thickness of copper: 18 35 50 70 100um4) The smallest width of line: 0.08mm5) The smallest distance of line: 008mm6) The smallest aperture: 0.25mm7) Max. size: 900 x 600mm8) Layers and structure: single double 4 layers rigid-flex mix. board9) Peel strength soldering: >0.7N/mm10) Soldering: PI 260 degree of Celsius 6s; PET 135 degree of Celsius 5s11) Flexural resistance: R=7, load 100g > 10412) Insulation resistance: >100MΩ (500V)13) Surface craft: gold sin/lead OSP
