Company name: Micro Soldering
Company type: Manufacturers ()
Area: Southeast Asia/Malaysia
Company size:
Registered capital: Not filled
Year of registration:
Data authentication:
Guaranteed funds: Already paid $0.00 USD
Business scope: Electroless NiAu-NiPdAu Plating,Solder Ball Rework,Backend and Assembly,Wafer Level Reflow Oven,Backside Laser Marking
Selling products: Electroless NiAu-NiPdAu Plating,Solder Ball Rework,Backend and Assembly,Wafer Level Reflow Oven,Backside Laser Marking